BGA - QFP - Plastic Packages - Package Design - IC Assembly

i2a Technologies has developed the open-cavity plastic package (OCP) solution to provide standard packaging which allows access to the semiconductor die of prototype ICs. OCP options include all QFP and BGA package types and match the standard package outline and footprints from those families.

OCP packaging is most often used by development engineers to debug new products. Open access to the actual chip within the package enables special inspection, testing, micro-probing, and even repair using focused ion beam (FIB) technology. These solutions are the ideal candidates for quick turn assemblies, engineering samples & die qualifications. Packages are fabricated in advance using standard QFP and BGA molded leadframes or substrates and are available for quick delivery of prototype ICs. Packages can be shipped with removable metal lids to prevent damage to the delicate chip & wire assembly during handling.