Chip Scale Packaging

In wafer-level chip-scale packaging (WLCSP) technology, the "package", or interconnect elements, are fabricated on the wafer prior to singulation. This makes it different from all other package types in that there is no assembly to a substrate, and the singulated WLCSP is ready for SMT mounting. The area it occupies when mounted onto a printed circuit board is the size of the die.

The greatest benefits of WLCSPs are the true chip-size product and the relative cost of wafer-level processing. All devices on a wafer are processed and and tested together in wafer form and later singulated into individual chips. Like wafer fabrication, the cost of the WLCSP goes down as the wafer size increases and as the die shrinks